JPH0173939U - - Google Patents
Info
- Publication number
- JPH0173939U JPH0173939U JP1987169056U JP16905687U JPH0173939U JP H0173939 U JPH0173939 U JP H0173939U JP 1987169056 U JP1987169056 U JP 1987169056U JP 16905687 U JP16905687 U JP 16905687U JP H0173939 U JPH0173939 U JP H0173939U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- semiconductor
- holes
- carrier
- rules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000012993 chemical processing Methods 0.000 description 4
- 239000012050 conventional carrier Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 2
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169056U JPH0173939U (en]) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169056U JPH0173939U (en]) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173939U true JPH0173939U (en]) | 1989-05-18 |
Family
ID=31458782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169056U Pending JPH0173939U (en]) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173939U (en]) |
-
1987
- 1987-11-06 JP JP1987169056U patent/JPH0173939U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0173939U (en]) | ||
| JPS58138340U (ja) | ウエハの洗浄・エツチング用キヤリア | |
| JPS63157054U (en]) | ||
| JPH0350329U (en]) | ||
| JPS62157148U (en]) | ||
| JPS6117742U (ja) | 半導体製造装置 | |
| JPS6054327U (ja) | 半導体製造装置 | |
| JP2548071B2 (ja) | ワイヤーボンディング用テーブル及びワイヤーボンディング方法 | |
| JPS6336048U (en]) | ||
| JPS58168139U (ja) | 半導体ウエハの吸着保持装置 | |
| JPS61131829U (en]) | ||
| JPH0330427U (en]) | ||
| JPH022828U (en]) | ||
| JPH0270429U (en]) | ||
| JPS6130243U (ja) | 半導体基板の搬出入装置 | |
| JPS63110042U (en]) | ||
| JPH0279036U (en]) | ||
| JPS6426831U (en]) | ||
| JPS60133631U (ja) | 赤外線熱処理装置 | |
| JPS62112148U (en]) | ||
| JPS6367235U (en]) | ||
| JPS60116234U (ja) | イオン注入用半導体基板保持装置 | |
| JPS62172153U (en]) | ||
| JPS62180947U (en]) | ||
| JPS6445841U (en]) |